Refurbished Gasonics Aura 1000

Manufacture:Gasonics

Refurbished by:Allwin21 Corp

Gasonics is a Registered Trademark of Novellus Corp.GaSonic Aura 1000 Plasma System is the microprocessor controlled down-stream, or “ afterglow” photoresist stripper that will strip the front and backside of a wafer, typically in less than one minute. The unit is fully automated, cassette-to-cassette, and is a single-wafer process design.




Single-wafer process
3”, 4”, 5” and 6” wafer capability
Automatic Equip robot wafer loader / unloader
Infrared heat source for process temperature control
Downstream processing: No wafer radiation damage(<0.1 volt CV shift)
Automatic photo emission type end-point detection
Front and backside resist removal
GaSonic Aura 1000 Applications
Photoresist Stripping

High dose implant (As+, B+, P+)
Post-polysilicon etch
Post-metal etch
Post-oxide etch
Rework
Controlled Resist Removal

Post-develop descum (pre-etch)
Dry/wet process capability
Resist planarization
Uniformity capability (5% 1s)
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Allwin21 Corp. can also provide advanced Equip Robot transfer wafer technology , AW Control Software and Superior Temperature Control Technology to upgrade the refurbished Gasonics Aura 1000 which provides the following significant advantages


Use Equip robot wafer transfer instead of the index of the original, which will decrease the down time and low the wafer damage, particles greatly
Pentium PC computer equipped either DOS Windows
Interface control board with parallel connectors between PC computer and the Aura-1000 system
New 16 bits A/D measurement system to replace original 12 bits A/D system to improve the accuracy of the measurements of gas flow, vacuum pressure, EOP, temperature of the wafer, etc. to improve the repeatability of the Asher process.
New 14 bits D/A system to replace original old 8 bits D/A to improve the accuracy of the set point of the vacuum pressure, gas flow, etc.
Add new RTP system to get more accuracy temperature control to improve the repeatability of the process. The new RTP system includes(1)New lamp control system with new special solid-state relay control system. It is similar to the oven control system of the RTP machine;(2)New zero crossing detects system. It is similar to the zero crossing detect of the RTP machine.(3)K-type thermocouple system with vacuum feed-through and amplifier to measure the temperature of the wafer. The thermocouple is touching the backside of the wafer directly. The feed-through is put on the front door, which is good when the wafer heated at 450 degree C.(4)Replace the center lamp of the system to be the same high power as the side one to speed up the heat speed and improve the uniformity of the asher and descum process.
User-friendly recipe editor with gas flow set point, vacuum pressure set point, RF on or off set up, temperature setup etc.
New GUI interface with curves display of the temperature, vacuum pressure, gas flow, RF status, EOP signal etc. during the process.
Saved all process data on the local hard disk and send data to the server if it is needed (option).
Saved all operation function, date, time and error message on the lot file.
Wafer ID reading function to read wafer ID and use the wafer ID for the data ID to save the process data. Data saved with 4 layers: (1) directory (say year 2003,2004), (2) lot ID, (3) Date Time or step ID, (4) wafer ID. So it is easy to trace the data.
Bar code function for the lot ID, recipe ID selection option.
Manual and auto process running
System diagnostics for the quick diagnostic of the system
Easier I/O set and checks function for the Maintenance
RTP function with temperature control ±1~2°C accuracy from 50 to 500°C with K-type thermocouple.
Higher through put.
Advanced accurate temperature control to make much better repeatability
Better uniformity duo to the center lamp has the same power as the side lamp
All process data saved and easier for failure analyzer and process debug
“Exposed” I/O, A/D, D/A is easier for troubleshooting and maintenance.

Manufacturer:Tegal
Refurbished by:Allwin21 Corp



Tegal 900 series Plasma/RIE etch System are used by the Semiconductor Industry for integrated circuit fabrication. The system are used in one part of the sequence of manufacturing steps that transfer a pattern formed from a layer of photosensitive material, the photoresist, to a layer that makes up a permanent part of the final device. The process of defining a pattern with photoresist known as photolithography, while the etch process transfers the photoresist pattern to the permanent layer.
Tegal 900 Series systems deliver highly reliable, repeatable results in etching a variety of films used to manufacture semiconductor, telecommunications and optoelectronics devices, flat panel displays and thin film magnetic heads.
Tegal 901e/903e,are designed around a production-proven wafer transport design that can accommodate 75 mm to 150 mm round silicon, GaAs, InP, and dielectric material substrates. The transport can also be configured to accommodate rectangular substrates up to 125 mm on a side.
Typical Applications for Tegal 901e:
1. Nitride etch,
2. Photoresist Descum,
3. Polyimide and BCB etches,
4. Zero Layer Etch,
5. Backside Etch,
6. Isotropic Oxide Etch,
7. Non-critical Polysilicon Etch
8. Titanium/Tantalum Alloy Etch.
Typical Applications for Tegal 903e:
1. GaAs, III-V materials,
2. Pad Etch,
3. Passivation Etch,
4. Oxide/Contact/Via Etch (Down to 0.8 micron),
5. LDD spacer Etch,
6. Polyimide ILD Etch,
7. Resist/SOG Planarization.

Plasma Etch


Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module, and every wafer undergoes many etching steps before it is complete.
If the etch is intended to make a cavity in a material, the depth of the cavity may be controlled approximately using the etching time and the known etch rate. More often, though, etching must entirely remove the top layer of a multilayer structure, without damaging the underlying or masking layers. The etching system's ability to do this depends on the ratio of etch rates in the two materials (selectivity).
Some etches undercut the masking layer and form cavities with sloping sidewalls. The distance of undercutting is called bias. Etchants with large bias are called isotropic.
Modern VLSI processes avoid wet etching, and use plasma etching instead. Plasma systems can operate in several modes by adjusting the parameters of the plasma. Ordinary plasma etching operates between 0.1 and 5 Torr. (This unit of pressure, commonly used in vacuum engineering, equals approximately 133.3 pascals) The plasma produces energetic free radicals, neutrally charged, that react at the surface of the wafer. Since neutral particles attack the wafer from all angles, this process is isotropic.
The source gas for the plasma usually contains small molecules rich in chlorine or fluorine. For instance, carbon tetrachloride (CCl4) etches silicon and aluminium, and trifluoromethane etches silicon dioxide and silicon nitride. A plasma containing oxygen is used to oxidize ("ash") photoresist and facilitate its removal.

Allwin21 Corp can provide the following refurbished Etcher equipment.

Refurbished Matrix303
Refurbished Matrix403
Refurbished Gasonics AE2001
Refurbished Gasonics PEP3510


Allwin21 Corp. can also provide Allwin21 Corp proprietary AW Control Software and Superior Temperature Control Technology to upgrade the refurbished equipment which provides the following significant advantages

Integrated process control system
Real time graphics display
Real time process data acquisition, display, and analysis
Programmed comprehensive calibration and diagnostic functions
Better performance and maintenance than the original systems

Plasma Asher Stripper Descum


In semiconductor manufacturing plasma asher/stripper is the process of removing the photoresist from an etched wafer. Using a plasma source, a monatomic reactive species is generated. Oxygen or fluorine are the most common reactive species. The reactive species combines with the photoresist to form ashing which is removed with a vacuum pump.

Typically, monatomic (single atom) oxygen plasma is created by exposing oxygen gas (O2) to ionizing radiation. At the same time, many free radicals are formed which could damage the wafer. Newer, smaller circuitry is increasingly susceptible to these particles. Originally, plasma was generated in the process chamber, but as the need to get rid of free radicals has increased, many machines now use a downstream plasma configuration, where plasma is formed remotely and channeled to the wafer. This allows electrically charged particles time to recombine before they reach the wafer surface, and prevents damage to the wafer surface.

Monatomic oxygen is electrically neutral and although it does recombine during the channeling, it does so at a slower rate than the positively or negatively charged free radicals, which attract one another. Effectively, this means that when all of the free radicals have recombined, there is still a portion of the active species available for process. Because a large portion of the active specie is lost to recombination, process times may take longer. To some extent, these longer process times can be mitigated by increasing the temperature of the reaction area.

Allwin21 Corp can provide the following refurbished plasma asher/descum equipment.

Refurbished Matrix 105
Refurbished Matrix 205
Refurbished Matrix 10
Refurbished Gasonics Aura 1000
Refurbished Gasonics Aura 2000
Refurbished Gasonics Aura 3010
Refurbished Gasonics L3510
Refurbished Branson IPC 3000
Refurbished Branson IPC L3200


Allwin21 Corp. can also provide Allwin21 Corp proprietary AW Control Software and Superior Temperature Control Technology to upgrade the refurbished equipment which provides the following significant advantages

Integrated process control system
Real time graphics display
Real time process data acquisition, display, and analysis
Programmed comprehensive calibration and diagnostic functions
Better performance and maintenance than the original systems

Rapid Thermal Process


Rapid thermal processing (or RTP) refers to a semiconductor manufacturing process which heats silicon wafers to high temperatures (up to 1200 C or greater) on a timescale of several seconds or less. The wafers must be brought down (temperature) slow enough however, so they do not break due to thermal shock..Such rapid heating rates are attained by high intensity lamps process. These processes are used for a wide variety of applications in semiconductor manufacturing including dopant activation, thermal oxidation, metal reflow and chemical vapor deposition.

Rapid thermal anneal (RTA) is a process used in semiconductor device fabrication which consists of heating a single wafer at a time in order to affect its electrical properties. Unique heat treatments are designed for different effects. Wafers can be heated in order to activate dopants, change film-to-film or film-to-wafer substrate interfaces, densify deposited films, change states of grown films, repair damage from ion implantation, move dopants or drive dopants from one film into another or from a film into the wafer substrate. Rapid thermal anneals are performed by equipment that heats a single wafer at a time using lamp based heating that a wafer is brought near. Unlike furnace anneals they are short in duration, processing each wafer in several minutes. Rapid thermal anneal is a subset of processes called Rapid Thermal Process (RTP).

AG Associates Heatpulse is one of the most famous RTP equipment manufacturers. Many Integrated Chip companies, R&D centers, Institutes all over the world have been using AG Heatpulse Systems.

Allwin21 Corp can provide the following refurbished RTP equipment

AG Heatpulse 210
AG Heatpulse 410
AG Heatpulse 610
AG Heatpulse 2100
AG Heatpulse 4100
AG Heatpulse 4100S
AG Heatpulse 4108
AG Heatpulse 8108


Allwin21 Corp. can also provide Allwin21 Corp proprietary AW Control Software and Superior Temperature Control Technology to upgrade the refurbished equipment which provides the following significant advantages

Integrated process control system
Real time graphics display
Real time process data acquisition, display, and analysis
Programmed comprehensive calibration and diagnostic functions
Better performance and maintenance than the original systems


Allwin21 is the exclusive licenced manufacture for AG Heatpulse 610. Allwin21 is manufacturing the AccuThermo AW-610,originally the AG Heatpulse 610.The AccuThermo AW-610 has innovative software and more advanced temperature control technologies.